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Investigation of CH4, NH3, H2 and He plasma treatment on porous low-k films and its effects on resisting moisture absorption and ions penetration
Lu, Hai-Sheng, Gottfried, Knut, Ahner, Nicole, Schulz, Stefan, Qu, Xin-PingVolume:
106
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2012.12.025
Date:
June, 2013
File:
PDF, 1.59 MB
english, 2013