Volume 106

Microelectronic Engineering

Volume 106

1

Si ohmic contacts on N-type SiC studied by XPS

Cichoň, Stanislav, Macháč, Petr, Barda, Bohumil, Kudrnová, Marie

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.35 MB

english, 2013

2

Nanoindentation for reliability assessment of ULK films and interconnects structures

Yeap, Kong Boon, Iacopi, Francesca, Geisler, Holm, Hangen, Ude, Zschech, Ehrenfried

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.20 MB

english, 2013

3

CVD of cobalt–tungsten alloy film as a novel copper diffusion barrier

Shimizu, Hideharu, Sakoda, Kaoru, Shimogaki, Yukihiro

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 835 KB

english, 2013

4

Structural optimization of the micro-membrane for a novel surface stress-based capacitive biosensor

Zhang, Wendong, Feng, Hui, Sang, Shengbo, Shi, Qiang, Hu, Jie, Li, Pengwei, Li, Gang

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 842 KB

english, 2013

5

Modeling the constitutive and frictional behavior of PTFE flexible stamps for nanoimprint lithography

Sonne, M.R., Hattel, J.H.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 762 KB

english, 2013

6

Electrical characterization of CNT contacts with Cu Damascene top contact

van der Veen, Marleen H., Vereecke, Bart, Huyghebaert, Cedric, Cott, Daire J., Sugiura, Masahito, Kashiwagi, Yusaku, Teugels, Lieve, Caluwaerts, Rudy, Chiodarelli, Nicolò, Vereecken, Philippe M., Beye

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 824 KB

english, 2013

7

Effect of TSV density on local stress concentration: Micro-Raman spectroscopy measurement and Finite Element Analysis

Le Texier, F., Mazuir, J., Su, M., Castagné, L., Souriau, J.-C., Liotard, J.-L., Saadaoui, M., Inal, K.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 894 KB

english, 2013

8

Interface engineering for the TaN/Ta barrier film deposition process to control Ta-crystal growth

Gerlich, Lukas, Ohsiek, Susanne, Klein, Christoph, Geiß, Mario, Friedemann, Michael, Kücher, Peter, Schmeißer, Dieter

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 937 KB

english, 2013

9

Selective self-assembled monolayer coating to enable Cu-to-Cu connection in dual damascene vias

Maestre Caro, A., Travaly, Y., Beyer, G., Tokei, Z., Maes, G., Borghs, G., Armini, S.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 756 KB

english, 2013

10

Chemisorption of ALD precursors in and on porous low-k films

Verdonck, P., Delabie, A., Swerts, J., Farrell, L., Baklanov, M.R., Tielens, H., Van Besien, E., Witters, T., Nyns, L., Van Elshocht, S.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 622 KB

english, 2013

11

Investigation of CH4, NH3, H2 and He plasma treatment on porous low-k films and its effects on resisting moisture absorption and ions penetration

Lu, Hai-Sheng, Gottfried, Knut, Ahner, Nicole, Schulz, Stefan, Qu, Xin-Ping

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.59 MB

english, 2013

12

Microstructural void environment characterization by electron imaging in 45nm technology node to link electromigration and copper microstructure

Galand, R., Brunetti, G., Arnaud, L., Rouvière, J.-L., Clément, L., Waltz, P., Wouters, Y.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 527 KB

english, 2013

13

Effectiveness of wafer level test for electromigration wear out reporting in advanced CMOS interconnects reliability assessment

Bana, F., Petitprez, E., Ney, D., Arnaud, L., Wouters, Y.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 735 KB

english, 2013

14

Comprehensive TDDB lifetime prediction methodology for intrinsic and extrinsic failures in Cu interconnect dielectrics

Suzumura, N., Ogasawara, M., Makabe, K., Kamoshima, T., Ouchi, T., Furusawa, T., Murakami, E.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 944 KB

english, 2013

15

Moisture absorption impact on Cu alloy/low-k reliability during process queue time

Tsuchiya, H., Yokogawa, S., Kunishima, H., Kuwajima, T., Usami, T., Miura, Y., Ohto, K., Fujii, K., Sakurai, M.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.12 MB

english, 2013

16

Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness

Yang, C.-C., Baumann, F., Wang, P.-C., Lee, S.Y., Ma, P., AuBuchon, J., Edelstein, D.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.21 MB

english, 2013

17

Series resistance study of Schottky diodes developed on 4H-SiC wafers using a contact of titanium or molybdenum

Shili, K., Ben Karoui, M., Gharbi, R., Abdelkrim, M., Fathallah, M., Ferrero, S.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 546 KB

english, 2013

18

Reactively sputtered HfO2 and Ba(Zr0.2Ti0.8)O3–HfO2 dielectrics for metal–insulator–metal capacitor applications

Zhang, Li-Feng, Xu, Hui, Zhang, Qiu-Xiang, Ding, Shi-Jin, Zhang, David Wei

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 962 KB

english, 2013

19

Full reliability study of advanced metallization options for 30nm ½pitch interconnects

Croes, Kristof, Demuynck, Steven, Siew, Yong Kong, Pantouvaki, Marianna, Wilson, Christopher J., Heylen, Nancy, Beyer, Gerald P., Tőkei, Zsolt

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 691 KB

english, 2013

20

Adhesion analysis for on-chip interconnect structures by beam bending techniques with optical crack length determination

Hentschel, R.L., Hecker, M., Hensel, M., Lehr, M.U., Breuer, D.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 726 KB

english, 2013

21

Electrochemical migration of Ag nanoink patterns controlled by atmospheric-pressure plasma

Kim, Kwang-Seok, Kwon, Young-Tae, Choa, Yong-Ho, Jung, Seung-Boo

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 2.72 MB

english, 2013

22

Investigation of aluminum film properties and microstructure for replacement metal gate application

Huang, R.P., Tsai, T.C., Lin, Welch, Huang, H.F., Tsai, M.C., Hsu, H.K., Hsu, C.M., Lin, J.F., Yang, C.L., Wu, J.Y.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 2.34 MB

english, 2013

23

Surface microstructuring and protein patterning using hyaluronan derivatives

Márquez-Posadas, M.C., Ramiro, J., Becher, J., Yang, Y., Köwitsch, A., Pashkuleva, I., Díez-Ahedo, R., Schnabelrauch, M., Reis, R.L., Groth, T., Merino, S.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1014 KB

english, 2013

24

Texture characterization of the NiSi film on Si substrate

Kimura, Hiroshi, Tomita, Ryuji

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.25 MB

english, 2013

25

On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing

Civale, Yann, Croes, Kristof, Miyamori, Yuichi, Velenis, Dimitrios, Redolfi, Augusto, Thangaraju, Sarasvathi, Ammel, Annemie Van, Cherman, Vladimir, Plas, Geert Van der, Cockburn, Andrew, Gravey, Virg

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 673 KB

english, 2013

26

Table of Contents

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 148 KB

english, 2013

27

Inside Front Cover - Editorial Board

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 31 KB

english, 2013

28

Study of the impact of doping concentration and Schottky barrier height on ohmic contacts to n-type germanium

Firrincieli, A., Martens, K., Simoen, E., Claeys, C., Kittl, J.A.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 270 KB

english, 2013

29

Water uptake of a low-κ dielectric film: Combining capacitance and gravimetric measurements

Kubasch, C., Bartha, J.W.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 582 KB

english, 2013

30

Study of Schottky barrier height modulation for NiSi/Si contact with an antimony interlayer

Guo, Xiao, Tang, Yang, Jiang, Yu-Long, Qu, Xin-Ping, Ru, Guo-Ping, Zhang, David Wei, Deduytsche, Davy, Detavernier, Christophe

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 914 KB

english, 2013

31

Fabrication and characterization of tunable multiferroic Bi0.7Dy0.3FeO3 based on-chip micro-inductor

Mandal, M., Duttagupta, S.P., Palkar, V.R.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 717 KB

english, 2013

32

Accelerated lifetime estimation of thermosonic Cu ball bonds on Al metallization

Lassnig, A., Trasischker, W., Khatibi, G., Weiss, B., Nelhiebel, M., Pelzer, R.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 3.15 MB

english, 2013

33

Comparison of quantum mechanical methods for the simulation of electronic transport through carbon nanotubes

Zienert, Andreas, Schuster, Jörg, Gessner, Thomas

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 504 KB

english, 2013

34

2011 MAM Committee

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 102 KB

english, 2013

35

Selected papers from the 20th European Workshop on Materials for Advanced Metallization 2011

Schulz, Stefan E., Zschech, Ehrenfried

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 104 KB

english, 2013

36

Atomic layer deposition of transition metals for silicide contact formation: Growth characteristics and silicidation

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.31 MB

english, 2013

37

Generation of periodic surface wrinkles using a single layer resin by a repetitive dividing volume (RDV) technique

Park, Sang-Hu, Park, Hee-Jin, Kim, Seong-Jin, Ireland, Peter

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.87 MB

english, 2013

38

Characterization of imprinted gratings based on transparent materials by transmission scatterometry

Pietroy, David, Gereige, Issam, Gourgon, Cécile

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 405 KB

english, 2013

39

Highly adhesive electroless barrier/Cu-seed formation for high aspect ratio through-Si vias

Inoue, Fumihiro, Shimizu, Tomohiro, Miyake, Hiroshi, Arima, Ryohei, Ito, Toshihiko, Seki, Hirofumi, Shinozaki, Yuko, Yamamoto, Tomohiko, Shingubara, Shoso

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 672 KB

english, 2013

40

Copper electrodeposition into macroporous silicon arrays for through silicon via applications

Defforge, T., Coudron, L., Ménard, O., Grimal, V., Gautier, G., Tran-Van, F.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 668 KB

english, 2013

41

Formation of SnAg solder bump by multilayer electroplating

Zhao, Qinghua, Chen, Zhuo, Hu, Anmin, Li, Ming

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 888 KB

english, 2013

42

Decreasing reaction rate at the end of silicidation: In-situ CoSi2 XRD study and modeling

Delattre, R., Simola, R., Rivero, C., Serradeil, V., Perrin-Pellegrino, C., Thomas, O.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 533 KB

english, 2013

43

Stress-induced voiding in nickel silicide

Futase, Takuya, Oashi, Toshiyuki, Maeda, Hitoshi, Inaba, Yutaka, Tanimoto, Hisanori

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 730 KB

english, 2013

44

Author Index

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 166 KB

english, 2013

45

Cu passivation for enhanced low temperature (⩽300°C) bonding in 3D integration

Lim, D.F., Wei, J., Leong, K.C., Tan, C.S.

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 837 KB

english, 2013

46

2011 IITC ORGANIZING COMMITTEE

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 108 KB

english, 2013

47

Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits

Made, Riko I, Lan, Peng, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 1.41 MB

english, 2013

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