Modeling and Application of Multi-Port TSV Networks in 3-D...

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 2013 / 04 Vol. 32; Iss. 4

Modeling and Application of Multi-Port TSV Networks in 3-D IC

Yao, Wei, Pan, Siming, Achkir, Brice, Fan, Jun, He, Lei
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Volume:
32
Language:
english
Journal:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI:
10.1109/TCAD.2012.2228740
Date:
April, 2013
File:
PDF, 6.47 MB
english, 2013
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