Modeling Package-Induced Effects on Molded Hall Sensors

IEEE Transactions on Advanced Packaging 2008 / 08 Vol. 31; Iss. 3

Modeling Package-Induced Effects on Molded Hall Sensors

Fischer, S., Wilde, J.
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2008.924241
Date:
August, 2008
File:
PDF, 1.16 MB
english, 2008
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