![](/img/cover-not-exists.png)
Modeling Package-Induced Effects on Molded Hall Sensors
Fischer, S., Wilde, J.Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2008.924241
Date:
August, 2008
File:
PDF, 1.16 MB
english, 2008