Volume 31; Issue 3

IEEE Transactions on Advanced Packaging

Volume 31; Issue 3

1

Modeling and Measurement of Interlevel Electromagnetic Coupling and Fringing Effect in a Hierarchical Power Distribution Network Using Segmentation Method With Resonant Cavity Model

Jaemin Kim, Youchul Jeong, Jingook Kim, Junho Lee, Chunghyun Ryu, Jongjoo Shim, Minchul Shin, Joungho Kim

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.84 MB

english, 2008

2

Modeling Package-Induced Effects on Molded Hall Sensors

Fischer, S., Wilde, J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.16 MB

english, 2008

3

Broadband Material Parameter Characterization for Practical High-Speed Interconnects on Printed Circuit Board

Cauwe, Maarten, De Baets, Johan

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 398 KB

english, 2008

4

One-Component, Low-Temperature, and Fast Cure Epoxy Encapsulant With High Refractive Index for LED Applications

Yan Zhou,, Nguyen Tran,, Yuan Chang Lin,, Yongzhi He,, Shi, F.G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 248 KB

english, 2008

5

Bourdel, S., Barthelemy, H., Cubillo, J.R., Gaubert, J.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.04 MB

english, 2008

6

Reflection Enhanced Compensation of Lossy Traces for Best Eye-Diagram Improvement Using High-Impedance Mismatch

Wei-Da Guo,, Feng-Neng Tsai,, Guang-Hwa Shiue,, Ruey-Beei Wu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.45 MB

english, 2008

7

Warpage Measurement of Board Assemblies Using Projection MoirÉ System With Improved Automatic Image Segmentation Algorithm

Tan, Wei, Ume, I. Charles

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.04 MB

english, 2008

8

Robust Causality Characterization via Generalized Dispersion Relations

Triverio, Piero, Grivet-Talocia, Stefano

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 843 KB

english, 2008

9

Perturbation Schemes for Passivity Enforcement of Delay-Based Transmission Line Macromodels

Chinea, A., Grivet-Talocia, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 620 KB

english, 2008

10

Effective Pigtailing Method for Fiber Arrays to InP-Based Photonic Integrated Circuits

van Zantvoort, J. H. C., Plukker, S. G. L., Dekkers, E. C. A., Khoe, G. D., Koonen, A. M. J., de Waardt, H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.00 MB

english, 2008

11

End-Facet Polishing of Surface Plasmon Waveguides in Lithium Niobate

Jette-Charbonneau, S., Lahoud, N., Charbonneau, R., Mattiussi, G., Berini, P.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 457 KB

english, 2008

12

A Recovery Algorithm of Linear Complexity in the Time-Domain Layered Finite Element Reduction Recovery (LAFE-RR) Method for Large-Scale Electromagnetic Analysis of High-Speed ICs

Houle Gan,, Dan Jiao,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 322 KB

english, 2008

13

Packaging and Assembly of 3-D Silicon Stacked Module for Image Sensor Application

Yoon, Seung Wook, Ganesh, V. P., Lim, Samuel Yak Long, Kripesh, Vaidyanathan

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.22 MB

english, 2008

14

A Packaging Solution for Optically Testing Wire-Bonded Chips

Tosi, Alberto, Stellari, Franco, Zappa, Franco, Song, Peilin

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 979 KB

english, 2008

15

Applications of Multilinear and Waveform Relaxation Methods for Efficient Simulation of Interconnect-Dominated Nonlinear Networks

Beyene, Wendemagegnehu (Wendem) T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 2.07 MB

english, 2008

16

Transient Stress Distributions in NCF-Bonded COG Packages due to Moisture Diffusion

Tsai, M. Y., Wu, C. Y., Huang, C. Y., Yang, S. S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.02 MB

english, 2008

17

Implementation of Packaged Integrated Antenna With Embedded Front End for Bluetooth Applications

Rotaru, Mihai, Ying, Lim Ying, Kuruveettil, Haridas, Rui, Yang, Popov, Alexander P., Chee-Parng, Chua

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.59 MB

english, 2008

18

Power and Interface Features of Thermosonic Flip-Chip Bonding

Li, Junhui, Han, Lei, Zhong, Jue

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.60 MB

english, 2008

19

Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach

Qi, Haiyu, Osterman, Michael, Pecht, Michael

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.65 MB

english, 2008

20

Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method

Wei, Xing-Chang, Li, Er-Ping, Liu, En-Xiao, Chua, Eng-Kee, Oo, Zaw-Zaw, Vahldieck, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1007 KB

english, 2008

21

Drainage-Induced Dry-Out of Thermal Greases

Nnebe, I.M., Feger, C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 891 KB

english, 2008

22

Proper Orthogonal Decomposition in the Generation of Reduced Order Models for Interconnects

Lin, Wu Zhong, Zhang, Yao Jiang, Li, Er Ping

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 549 KB

english, 2008

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