Thermal Stability of Thermal Interface Pastes, Evaluated by...

Journal of Electronic Packaging 2001 Vol. 123; Iss. 3

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Luo, Xiangcheng, Xu, Yunsheng, Chung, D. D. L.
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Volume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1371925
File:
PDF, 1.30 MB
english, 2001
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