Volume 123; Issue 3

Journal of Electronic Packaging

Volume 123; Issue 3

1

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Luo, Xiangcheng, Xu, Yunsheng, Chung, D. D. L.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 1.30 MB

english, 2001

2

Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

Chang, J. Y., Yu, C. W., Webb, R. L.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 728 KB

english, 2001

3

Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape

Culham, J. R., Yovanovich, M. M., Teertstra, P., Wang, C.-S., Refai-Ahmed, G., Tain, Ra-Min

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 141 KB

english, 2001

4

Warpage of Plastic IC Packages as a Function of Processing Conditions

Yeung, Dickson T. S., Yuen, Matthew M. F.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 337 KB

english, 2001

5

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Uschitsky, M., Suhir, E., Kammlott, G. W.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 739 KB

english, 2001

6

Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy

Neu, R. W., Scott, D. T., Woodmansee, M. W.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 598 KB

english, 2001

7

Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement

Garimella, Suresh V., Schroeder, Vincent P.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 190 KB

english, 2001

8

Free Abrasive Machining in Slicing Brittle Materials With Wiresaw

Yang, Fuqian, Kao, Imin

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 368 KB

english, 2001

9

A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages

Vargas, J. V. C., Stanescu, G., Florea, R., Campos, M. C.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 747 KB

english, 2001

10

Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys

Wang, G. Z., Cheng, Z. N., Becker, K., Wilde, J.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 149 KB

english, 2001

11

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

Shetty, S., Lehtinen, V., Dasgupta, A., Halkola, V., Reinikainen, T.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 764 KB

english, 2001

12

Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material

Wei, Y., Chow, C. L., Fang, H. E., Neilsen, M. K.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 363 KB

english, 2001

13

Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages

Gu, Yu, Nakamura, Toshio, Chen, William T., Cotterell, Brian

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 581 KB

english, 2001

14

Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

Take, Koichiro, Webb, Ralph L.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 272 KB

english, 2001

15

Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses

Evans, A. G., He, M. Y., Hutchinson, J. W., Shaw, M.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 407 KB

english, 2001

16

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Basaran, Cemal, Zhao, Ying

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 276 KB

english, 2001

17

Orientation Specific Thermal Properties of Polyimide Film

Samuels, Robert J., Mathis, Nancy E.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 125 KB

english, 2001

18

The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

Wu, Y. P., Tu, P. L., Chan, Yan C.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 431 KB

english, 2001

19

Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

Fan, S. H., Chan, Y. C., Lai, J. K. L.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 697 KB

english, 2001

20

A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

Shidore, Sarang, Lee, Tien Yu Tom

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 461 KB

english, 2001

21

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Du, Yong, Zhao, Jie-Hua, Ho, Paul

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 74 KB

english, 2001

22

Industrial Electonics: Devices and Systems, Second Edition

Patrick, Dale R., Fardo, Stephen W., Rafanelli, Anthony J.

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 44 KB

english, 2001

23

Sizing of Heat Spreaders Above Dielectric Layers

Chen, Calvin, Hodes, Marc, Manzione, Lou

Journal:

Journal of Electronic Packaging

Year:

2001

File:

PDF, 262 KB

2001

24

Sizing of Heat Spreaders Above Dielectric Layers

Chen, Calvin, Hodes, Marc, Manzione, Lou

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 262 KB

english, 2001

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