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Adhesion analysis for on-chip interconnect structures by beam bending techniques with optical crack length determination
Hentschel, R.L., Hecker, M., Hensel, M., Lehr, M.U., Breuer, D.Volume:
106
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2012.12.029
Date:
June, 2013
File:
PDF, 726 KB
english, 2013