Adhesion analysis for on-chip interconnect structures by...

Adhesion analysis for on-chip interconnect structures by beam bending techniques with optical crack length determination

Hentschel, R.L., Hecker, M., Hensel, M., Lehr, M.U., Breuer, D.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
106
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2012.12.029
Date:
June, 2013
File:
PDF, 726 KB
english, 2013
Conversion to is in progress
Conversion to is failed