Foil-to-foil lamination and electrical interconnection of...

Microelectronic Engineering 2013 / 10 Vol. 110

Foil-to-foil lamination and electrical interconnection of printed components on flexible substrates

Vásquez Quintero, Andrés, van Remoortere, Bart, Smits, Edsger C.P., van den Brand, Jeroen, Briand, Danick, Schoo, Herman F.M., de Rooij, Nico F.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
110
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.04.040
Date:
October, 2013
File:
PDF, 2.24 MB
english, 2013
Conversion to is in progress
Conversion to is failed