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Packaging for microelectromechanical and nanoelectromechanical systems
Lee, Y.C., Parviz, B.A., Chiou, J.A., Chen, S.Volume:
26
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2003.817973
Date:
August, 2003
File:
PDF, 1006 KB
english, 2003