Volume 26; Issue 3

IEEE Transactions on Advanced Packaging

Volume 26; Issue 3

1

Fabrication, assembly, and testing of RF MEMS capacitive switches using flexible printed circuit technology

Ramadoss, R., Lee, S., Lee, Y.C., Bright, V.M., Gupta, K.C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1.45 MB

english, 2003

2

Single wafer encapsulation of mems devices

Candler, R.N., Woo-Tae Park,, Huimou Li,, Yama, G., Partridge, A., Lutz, M., Kenny, T.W.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 711 KB

english, 2003

3

Chip-level vacuum packaging of micromachines using nanogetters

Sparks, D.R., Massoud-Ansari, S., Najafi, N.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1.72 MB

english, 2003

4

Packaging for microelectromechanical and nanoelectromechanical systems

Lee, Y.C., Parviz, B.A., Chiou, J.A., Chen, S.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1006 KB

english, 2003

5

High density, high aspect ratio through-wafer electrical interconnect vias for mems packaging

Seong Joon Ok,, Chunho Kim,, Baldwin, D.F.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1.41 MB

english, 2003

6

Low temperature glass-to-glass wafer bonding

Jun Wei,, Nai, S.M.L., Wong, C.K.S., Zheng Sun,, Loke Chong Lee,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1.70 MB

english, 2003

7

Using self-assembly for the fabrication of nano-scale electronic and photonic devices

Parviz, B.A., Ryan, D., Whitesides, G.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 668 KB

english, 2003

8

Thermal solutions for discrete and wafer-level rf mems switch packages

Mercado, L.L., Tien-Yu Tom Lee,, Shun-Meen Kuo,, Hause, V., Amrine, C.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1.90 MB

english, 2003

9

The design and assembly of surface-micromachined optical switch for optical add/drop multiplexer application

Yu-Chen Lin,, Jin-Chern Chiou,, Wei-Ting Lin,, Yung-Jiun Lin,, Shuen-De Wu,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 696 KB

english, 2003

10

Polydimethylsioxane fluidic interconnects for microfluidic systems

Shifeng Li,, Shaochen Chen,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1019 KB

english, 2003

11

The package integration of rf-mems switch and control ic for wireless applications

De Silva, A.P., Hughes, H.G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 1.31 MB

english, 2003

12

Improving corrosion-resistance of polysilicon using boron doping and self-induced galvanic bias

Stark, B.H., Dokmeci, M.R., Najafi, K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 858 KB

english, 2003

13

Simulations for thermal warpage and pressure nonlinearity of monolithic cmos pressure sensors

Journal:

IEEE Transactions on Advanced Packaging

Year:

2003

Language:

english

File:

PDF, 693 KB

english, 2003

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