Broadband Material Parameter Characterization for Practical...

IEEE Transactions on Advanced Packaging 2008 / 08 Vol. 31; Iss. 3

Broadband Material Parameter Characterization for Practical High-Speed Interconnects on Printed Circuit Board

Cauwe, Maarten, De Baets, Johan
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Volume:
31
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2008.927853
Date:
August, 2008
File:
PDF, 398 KB
english, 2008
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