Electrical Performance and Reliability Investigation of...

IEEE Transactions on Electron Devices 2013 / 10 Vol. 60; Iss. 10

Electrical Performance and Reliability Investigation of Cosputtered Cu/Ti Bonded Interconnects

Chen, Hsiao-Yu, Hsu, Sheng-Yao, Chen, Kuan-Neng
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Volume:
60
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2013.2278396
Date:
October, 2013
File:
PDF, 1.02 MB
english, 2013
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