Experimental modeling, repeatability investigation and...

IEEE Transactions on Advanced Packaging 2001 / Nov. Vol. 24; Iss. 2

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Sutono, A., Cafaro, N.G., Laskar, J., Tentzeris, M.M.
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Volume:
24
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.982850
Date:
January, 2001
File:
PDF, 338 KB
english, 2001
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