Volume 24; Issue 2

IEEE Transactions on Advanced Packaging

Volume 24; Issue 2

1

Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Sutono, A., Cafaro, N.G., Laskar, J., Tentzeris, M.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 338 KB

english, 2001

2

Chip-scale packaging of power devices and its application in integrated power electronics modules

Xingsheng Liu,, Xiukuan Jing,, Guo-Quan Lu

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 847 KB

english, 2001

3

Time domain modeling of lossy interconnects

Svensson, C., Dermer, G.H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 98 KB

english, 2001

4

Mounting of high power laser diodes on boron nitride heat sinks using an optimized Au/Sn metallurgy

Pittroff, W., Erbert, G., Beister, G., Bugge, F., Klein, A., Knauer, A., Maege, J., Ressel, P., Sebastian, J., Staske, R., Traenkle, G.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 356 KB

english, 2001

5

Empirical equations on electrical parameters of coupled microstrip lines for crosstalk estimation in printed circuit board

. Young-soo Sohn, . Jeong-cheol Lee, . Hong-june Park, . Soo-in Cho

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 187 KB

english, 2001

6

Optimal shapes of fully embedded channels for conjugate cooling

Fisher, T.S., Torrance, K.E.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 156 KB

english, 2001

7

Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Ho, C.E., Tsai, S.Y., Kao, C.R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 166 KB

english, 2001

8

An overview of solder bump shape prediction algorithms with validations

Kuo-Ning Chiang,, Chang-An Yuan,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 138 KB

english, 2001

9

Modeling of simultaneous switching noise in high speed systems

Sungjun Chun,, Swaminathan, M., Smith, L.D., Srinivasan, J., Zhang Jin,, Iyer, M.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 251 KB

english, 2001

10

Electron beam enhanced multilayering and planarization in preimidized polyimides

Manepalli, R., Kovach, D.J., Farnsworth, K., Chiniwalla, P., Dusch, B., Bidstrup-Allen, S.A., Kohl, P.A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 248 KB

english, 2001

11

Modeling DC power-bus structures with vertical discontinuities using a circuit extraction approach based on a mixed-potential integral equation

Jun Fan,, Hao Shi,, Orlandi, A., Knighten, J.L., Drewniak, J.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 372 KB

english, 2001

12

Effect of temperature cycling on joint strength of PbSn and AuSn solders in laser packages

Jao-Hwa Kuang,, Maw-Tyan Sheen,, Chang, C.-F.H., Chai-Cheng Chen,, Gow-Ling Wang,, Wood-Hi Cheng,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 112 KB

english, 2001

13

Rules for robust generation of accurate reduced-order models for high-speed coupled interconnections

Cangellaris, A.C., Igarashi, M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 120 KB

english, 2001

14

Failure analysis and stress simulation in small multichip BGAs

Moore, T.D., Jarvis, J.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 228 KB

english, 2001

15

Single mode fiber MT-RJ SFF transceiver module using optical subassembly with a new shielded silicon optical bench

Iwase, M., Nomura, T., Izawa, A., Mori, H., Tamura, S., Shirai, T., Kamiya, T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 465 KB

english, 2001

16

Multichip module photovoltaic miniarrays

Ortego, P.R., Bermejo, S., Castaner, L.M.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 149 KB

english, 2001

17

Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability

Pang, J.H.L., Kar Hwee Ang,, Shi, X.Q., Wang, Z.P.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 538 KB

english, 2001

18

Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps

Sasaki, J., Itoh, M., Tamanuki, T., Hatakeyama, H., Kitamura, S., Shimoda, T., Kato, T.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 185 KB

english, 2001

19

Interconnections based on Bi-coated SnAg solder balls

Korhonen, T.-M., Vuorinen, V., Kivilahti, J.K.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 287 KB

english, 2001

20

Correction to "Lossy power distribution networks with thin dielectric layers and/or thin conductive layers"

Novak, I., Smith, L., Roy, T., Anderson, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

File:

PDF, 6 KB

2001

21

An all-purpose dispersive multiconductor interconnect model compatible with PRIMA

Pasha, S., Cangellaris, A.C., Prince, J.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 103 KB

english, 2001

22

Nondestructive methodology for standoff height measurement of flip chip on flex (FCOF) by SAM

Tang, C.W., Chan, Y.C., Hung, K.C., Webb, D.P.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 164 KB

english, 2001

23

Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

Pang, J.H.L., Chong, D.Y.R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 170 KB

english, 2001

24

High performance selectively oxidized VCSELs and arrays for parallel high-speed optical interconnects

Mederer, F., Ecker, I., Joos, J., Kicherer, M., Unold, H.J., Ebeling, K.J., Grabherr, M., Jager, R., King, R., Wiedenmann, D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 274 KB

english, 2001

25

Characterization of 63Sn37Pb and 80Au2OSn solder sealed optical fiber feedthroughs subjected to repetitive thermal cycling

Beranek, M.W., Rassaian, M., Tang, C.-H., St John, C.L., Loebs, V.A.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 371 KB

english, 2001

26

A hybrid 2-D ADI-FDTD subgridding scheme for modeling on-chip interconnects

Bing-Zhong Wang,, Yingjun Wang,, Wenhua Yu,, Mittra, R.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 136 KB

english, 2001

27

Single level integrated packaging modules for high performance electronic systems

Li-Rong Zheng,, Tenhunen, H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 235 KB

english, 2001

28

Effect of intermetallic compounds on vibration fatigue of μBGA solder joint

Tu, P.L., Chan, Y.C., Lai, J.K.L.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 832 KB

english, 2001

29

Analysis of the bounces on the power/ground plane structures by planar circuit model and APA-E algorithm

Xiaoping Yang,, Zhengfan Li,, Junfa Mao,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 161 KB

english, 2001

30

Packaging technology for high performance CMOS server Fujitsu GS8900

Fujisaki, A., Suzuki, M., Yamamoto, H.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 273 KB

english, 2001

31

The evolution of passive devices in WDM networks

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 145 KB

english, 2001

32

Electrical performance improvements on RFICs using bump chip carrier packages as compared to standard thin shrink small outline packages

Tzyy-Sheng Horng,, Sung-Mao Wu,, Chi-Tsung Chiu,, Chih-Pin Hung,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2001

Language:

english

File:

PDF, 188 KB

english, 2001

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