Wafer bonding using Cu–Sn intermetallic bonding layers
Flötgen, C., Pawlak, M., Pabo, E., Wiel, H. J., Hayes, G. R., Dragoi, V.Volume:
20
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-013-2002-x
Date:
April, 2014
File:
PDF, 676 KB
english, 2014