Investigation of aluminum film properties and...

Microelectronic Engineering 2013 / 6 Vol. 106

Investigation of aluminum film properties and microstructure for replacement metal gate application

Huang, R.P., Tsai, T.C., Lin, Welch, Huang, H.F., Tsai, M.C., Hsu, H.K., Hsu, C.M., Lin, J.F., Yang, C.L., Wu, J.Y.
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Volume:
106
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.02.016
Date:
June, 2013
File:
PDF, 2.34 MB
english, 2013
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