Study of die attach technologies for high temperature power...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy

Sabbah, Wissam, Azzopardi, Stéphane, Buttay, Cyril, Meuret, Régis, Woirgard, Eric
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.101
Date:
September, 2013
File:
PDF, 1.51 MB
english, 2013
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