Volume 53; Issue 9-11

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Microelectronics Reliability
Volume 53; Issue 9-11

Microelectronics Reliability

Volume 53; Issue 9-11

1

Impact of NBTI/PBTIon SRAMs within microprocessor systems: Modeling, simulation, and analysis

Chen, Chang-Chih, Ahmed, Fahad, Milor, Linda

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.46 MB

english, 2013

2

Optical losses in single-mode laser diodes

Vanzi, M., Mura, G., Marongiu, M., Tomasi, T.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.00 MB

english, 2013

3

Transient device simulation of neutron-induced failure in IGBT: A first step for developing a compact predictive model

Guetarni, K., Touboul, A.D., Boch, J., Foro, L., Privat, A., Michez, A., Vaillé, J.R., Saigné, F.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.02 MB

english, 2013

4

Estimation of power MOSFET junction temperature during avalanche mode: Experimental tests and modelling

Azoui, T., Tounsi, P., Dorkel, J.M., Reynes, J.M., Massol, J.L., Pomes, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.00 MB

english, 2013

5

The effect of water on the mechanical properties of native oxide coated silicon structure in MEMS

Zhang, Yun-An, Tao, Jun-Yong, Wang, Yan-Lei, Ren, Zhi-Qian, Liu, Bin, Chen, Xun

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.65 MB

english, 2013

6

Influence of gate leakage current on AlGaN/GaN HEMTs evidenced by low frequency noise and pulsed electrical measurements

Karboyan, S., Tartarin, J.G., Rzin, M., Brunel, L., Curutchet, A., Malbert, N., Labat, N., Carisetti, D., Lambert, B., Mermoux, M., Romain-Latu, E., Thomas, F., Bouexière, C., Moreau, C.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.22 MB

english, 2013

7

Properties of contactless and contacted charging in MEMS capacitive switches

Koutsoureli, M., Michalas, L., Martins, P., Papandreou, E., Leuliet, A., Bansropun, S., Papaioannou, G., Ziaei, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 906 KB

english, 2013

8

Analysis of Schottky gate degradation evolution in AlGaN/GaN HEMTs during HTRB stress

Brunel, L., Lambert, B., Mezenge, P., Bataille, J., Floriot, D., Grünenpütt, J., Blanck, H., Carisetti, D., Gourdel, Y., Malbert, N., Curutchet, A., Labat, N.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.40 MB

english, 2013

9

Statistics and localisation of vertical breakdown in AlGaN/GaN HEMTs on SiC and Si substrates for power applications

Fleury, Clément, Zhytnytska, Rimma, Bychikhin, Sergey, Cappriotti, Mattia, Hilt, Oliver, Visalli, Domenica, Meneghesso, Gaudenzio, Zanoni, Enrico, Würfl, Joachim, Derluyn, Joff, Strasser, Gottfried, P

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.61 MB

english, 2013

10

Physically based analytical model of the blocking I–V curve of Trench IGBTs

Maresca, L., Romano, G., Breglio, G., Irace, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.64 MB

english, 2013

11

Conducted and radiated EMI evolution of power RF N-LDMOS after accelerated ageing tests

Tlig, M., Ben Hadj Slama, J., Belaid, M.A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 991 KB

english, 2013

12

Long-term Electro-Magnetic Robustness of Integrated Circuits: EMRIC research project

Ben Dhia, S., Boyer, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.49 MB

english, 2013

13

Symmetrical ESD protection for advanced CMOS technology dedicated to 100GHz RF application

Galy, Ph., Lim, T., Bourgeat, J., Jimenez, J., Heitz, B., Marin-Cudraz, D., Benech, Ph., Fournier, J.M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.17 MB

english, 2013

14

Impact of field-plate geometry on the reliability of GaN-on-SiC HEMTs

Chini, A., Soci, F., Fantini, F., Nanni, A., Pantellini, A., Lanzieri, C., Meneghesso, G., Zanoni, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.11 MB

english, 2013

15

Application of quantitative modal analysis for investigation of thermal degradation of microelectronic packages

Rafiee, P., Khatibi, G., Nelhiebel, N., Pelzer, R.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.80 MB

english, 2013

16

High optical strength GaAs-based laser structures

Bettiati, Mauro A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 761 KB

english, 2013

17

Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy

Sabbah, Wissam, Azzopardi, Stéphane, Buttay, Cyril, Meuret, Régis, Woirgard, Eric

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.51 MB

english, 2013

18

Saint-Venant’s principle and the minimum length of a dual-coated optical fiber specimen in reliability (proof) testing

Suhir, E., Bechou, L.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 286 KB

english, 2013

19

Defect signatures in degraded high power laser diodes

Hortelano, V., Anaya, J., Souto, J., Jiménez, J., Perinet, J., Laruelle, F.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1000 KB

english, 2013

20

Comparison of the performances of an InAlN/GaN HEMT with a Mo/Au gate or a Ni/Pt/Au gate

Rossetto, I., Rampazzo, F., Silvestri, R., Zanandrea, A., Dua, C., Delage, S., Oualli, M., Meneghini, M., Zanoni, E., Meneghesso, G.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 684 KB

english, 2013

21

Embedded packaging and assembly; Reliability and supply chain implications

Bauer, Charles E., Neuhaus, Herbert J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.15 MB

english, 2013

22

LDO regulator DC characteristic and susceptibility prediction after electrical stress ageing

Wu, J., Boyer, A., Li, J., Bendhia, S., Vrignon, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.15 MB

english, 2013

23

Reverse-bias stress of high electron mobility transistors: Correlation between leakage current, current collapse and trap characteristics

Rossetto, I., Meneghini, M., Meneghesso, G., Zanoni, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.75 MB

english, 2013

24

A novel method to measure the internal pressure of MEMS thin-film packages

Wang, B., De Coster, J., Wevers, M., De Wolf, I.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

25

The effect of moisture on the degradation mechanism of multi-crystalline silicon photovoltaic module

Kim, T.H., Park, N.C., Kim, D.H.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.34 MB

english, 2013

26

Characterization and modeling of laser-induced single-event burn-out in SiC power diodes

Mbaye, N., Pouget, V., Darracq, F., Lewis, D.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 931 KB

english, 2013

27

Direct observation of the generation of breakdown spots in MIM structures under constant voltage stress

Saura, X., Moix, D., Suñé, J., Hurley, P.K., Miranda, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

28

Power MOSFET active power cycling for medical system reliability assessment

Sow, Amadou, Somaya, Sinivassane, Ousten, Yves, Vinassa, Jean-Michel, Patoureaux, Fanny

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.27 MB

english, 2013

29

The effect of encapsulant discoloration and delamination on the electrical characteristics of photovoltaic module

Park, N.C., Jeong, J.S., Kang, B.J., Kim, D.H.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.50 MB

english, 2013

30

A low-cost built-in error correction circuit design for STT-MRAM reliability improvement

Kang, Wang, Zhao, WeiSheng, Wang, Zhaohao, Zhang, Yue, Klein, Jacques-Olivier, Zhang, Youguang, Chappert, Claude, Ravelosona, Dafiné

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 944 KB

english, 2013

31

Contoured device sample preparation technique for ±5μm remaining silicon thicknesses that meets solid immersion lens requirements

Richardson, Chris, Liechty, Gary, Smith, Clay, Karow, Michael

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.83 MB

english, 2013

32

Electrical modeling of the photoelectric effect induced by a pulsed laser applied to an SRAM cell

Sarafianos, A., Roscian, C., Dutertre, J.-M., Lisart, M., Tria, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.86 MB

english, 2013

33

Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations

d’Alessandro, Vincenzo, Magnani, Alessandro, Riccio, Michele, Iwahashi, Yohei, Breglio, Giovanni, Rinaldi, Niccolò, Irace, Andrea

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.34 MB

english, 2013

34

Modeling dose effects in electronics devices: Dose and temperature dependence of power MOSFET

Michez, A., Boch, J., Dhombres, S., Saigné, F., Touboul, A.D., Vaillé, J.-R., Dusseau, L., Lorfèvre, E., Ecoffet, R.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 701 KB

english, 2013

35

Distributed electro-thermal model of IGBT chip – Application to top-metal ageing effects in short circuit conditions

Moussodji, J., Kociniewski, T., Khatir, Z.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.61 MB

english, 2013

36

“Hot-plugging” of LED modules: Electrical characterization and device degradation

Dal Lago, M., Meneghini, M., Trivellin, N., Mura, G., Vanzi, M., Meneghesso, G., Zanoni, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.32 MB

english, 2013

37

A nonlinear degradation path dependent end-of-life estimation framework from noisy observations

Cucu Laurenciu, N., Cotofana, S.D.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 564 KB

english, 2013

38

Effect of moisture swelling on MEMS packaging and integrated sensors

Keller, J., Mrossko, R., Dobrinski, H., Stürmann, J., Döring, R., Dudek, R., Rzepka, S., Michel, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.49 MB

english, 2013

39

Scanning probe microscopy based electrical characterization of thin dielectric and organic semiconductor films

Hofer, Alexander, Biberger, Roland, Benstetter, Günther, Wilke, Björn, Göbel, Holger

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.69 MB

english, 2013

40

Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects

Czerny, B., Paul, I., Khatibi, G., Thoben, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.61 MB

english, 2013

41

GaAs P-HEMT MMIC processes behavior under multiple heavy ion radiation stress conditions combined with DC and RF biasing

Bensoussan, A., Marec, R., Muraro, J.L., Portal, L., Calvel, P., Barillot, C., Perichaud, M.G., Marchand, L., Vignon, G.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.68 MB

english, 2013

42

A novel soldering method to evaluate PCB pad cratering for pin-pull testing

Cai, M., Xie, D.J., Chen, W.B., Wu, B.Y., Yang, D.G., Zhang, G.Q.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.92 MB

english, 2013

43

Surface roughness effect on copper–alumina adhesion

Lim, Ju Dy, Susan, Yeow Su Yi, Daniel, Rhee MinWoo, Leong, Kam Chew, Wong, Chee Cheong

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.32 MB

english, 2013

44

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads

Meinshausen, L., Frémont, H., Weide-Zaage, K., Plano, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.62 MB

english, 2013

45

Thermal and electrical investigation of the reverse bias degradation of silicon solar cells

Compagnin, Alessandro, Meneghini, Matteo, Barbato, Marco, Giliberto, Valentina, Cester, Andrea, Vanzi, Massimo, Mura, Giovanna, Zanoni, Enrico, Meneghesso, Gaudenzio

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.79 MB

english, 2013

46

Robustness of 1.2kV SiC MOSFET devices

Othman, D., Lefebvre, S., Berkani, M., Khatir, Z., Ibrahim, A., Bouzourene, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.32 MB

english, 2013

47

Thermal instability during short circuit of normally-off AlGaN/GaN HFETs

Abbate, C., Iannuzzo, F., Busatto, G.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.64 MB

english, 2013

48

Trends in automotive power semiconductor packaging

Dietrich, Peter

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.08 MB

english, 2013

49

High temperature gate-bias and reverse-bias tests on SiC MOSFETs

Yang, L., Castellazzi, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 617 KB

english, 2013

50

Design issues of a thin-film p-channel SOI power MOSFET for high-temperature applications

Yoshimura, Masayuki, Uchida, Atsushi, Matsumoto, Satoshi

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.75 MB

english, 2013

51

Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach

Baccar, F., Azzopardi, S., Theolier, L., El Boubkari, K., Deletage, J-Y., Woirgard, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

52

MEMS packaging reliability assessment: Residual Gas Analysis of gaseous species trapped inside MEMS cavities

Charvet, P.-L., Nicolas, P., Bloch, D., Savornin, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.52 MB

english, 2013

53

Conclusion of the accelerated stress conditions affecting phosphor-converted LEDs using the fractional factorial design method

Yoon, Y.G., Kang, J.H., Jang, I.H., Chan, S.I., Jang, J.S.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.35 MB

english, 2013

54

Observation of impurity diffusion defect in IGBT using a laser terahertz emission microscope technique

Goto, Yasunori, Matsumoto, Toru, Nikawa, Kiyoshi

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.20 MB

english, 2013

55

Impact of negative bias temperature instability on the single-event upset threshold of a 65nm SRAM cell

El Moukhtari, I., Pouget, V., Larue, C., Darracq, F., Lewis, D., Perdu, P.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.25 MB

english, 2013

56

Methodology for improvement of data retention in floating gate flash memory using leakage current estimation

Moon, Pyung, Lim, Jun Yeong, Youn, Tae-Un, Noh, Keum-Whan, Park, Sung-Kye, Yun, Ilgu

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.06 MB

english, 2013

57

Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs

Poller, T., D’Arco, S., Hernes, M., Rygg Ardal, A., Lutz, J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.01 MB

english, 2013

58

Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers

Metzger, A.G., d’Alessandro, V., Rinaldi, N., Zampardi, P.J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 955 KB

english, 2013

59

On-chip measurement to analyze failure mechanisms of ICs under system level ESD stress

Caigneť, F., Nolhier, N., Bafleur, M., Wang, A., Mauran, N.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.89 MB

english, 2013

60

Dynamic Near-Field Scanning Thermal Microscopy on thin films

Heiderhoff, R., Li, H., Riedl, T.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 850 KB

english, 2013

61

Access resistor modelling for EEPROM’s retention test vehicle

Canet, P., Postel-Pellerin, J., Ogier, J.L.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.14 MB

english, 2013

62

Impact of high frequency current ripple on supercapacitors ageing through floating ageing tests

German, R., Briat, O., Sari, A., Venet, P., Ayadi, M., Zitouni, Y., Vinassa, J.M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 993 KB

english, 2013

63

Thermal cycling impacts on supercapacitor performances during calendar ageing

Ayadi, M., Briat, O., Eddahech, A., German, R., Coquery, G., Vinassa, J.M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 544 KB

english, 2013

64

Failure analysis and detection methodology for capacitive RF-MEMS switches based on BEOL BiCMOS process

Torres Matabosch, N., Coccetti, F., Kaynak, M., Espana, B., Tillack, B., Cazaux, J.L.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 875 KB

english, 2013

65

Fatigue life evaluation of aluminum bonding wire in silicone gel under random vibration testing

Sasaki, K., Ohno, N.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.65 MB

english, 2013

66

Benefits of field failure distribution modeling to the failure analysis

Bergès, C., Goxe, J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 972 KB

english, 2013

67

Approach of a physically based lifetime model for solder layers in power modules

Steinhorst, P., Poller, T., Lutz, J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 739 KB

english, 2013

68

Thermal characterizations of Cu nanoparticle joints for power semiconductor devices

Ishizaki, T., Satoh, T., Kuno, A., Tane, A., Yanase, M., Osawa, F., Yamada, Y.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.24 MB

english, 2013

69

Influence of copper on the diffusion length of the minority carriers in devices based on n-type Si/SiO2

Kolkovsky, Vl., Lukat, K.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 549 KB

english, 2013

70

Field failure mechanism and reproduction due to moisture for low-voltage ZnO varistors

Jeong, Jae-Seong

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.80 MB

english, 2013

71

Failure causes generating aluminium protrusion/extrusion

Jacob, Peter, Nicoletti, Giovanni

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.04 MB

english, 2013

72

Supercapacitors aging diagnosis using least square algorithm

Oukaour, A., Pouliquen, M., Tala-Ighil, B., Gualous, H., Pigeon, E., Gehan, O., Boudart, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 614 KB

english, 2013

73

Extending the lifetime of power electronic assemblies by increased cooling temperatures

Hutzler, Aaron, Tokarski, Adam, Schletz, Andreas

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 735 KB

english, 2013

74

The role of the optical trans-characteristics in laser diode analysis

Mura, G., Vanzi, M., Marcello, G., Cao, R.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 953 KB

english, 2013

75

Bidirectional electromigration failure

Lim, M.K., Chouliaras, V.A., Gan, C.L., Dwyer, V.M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 737 KB

english, 2013

76

Temperature-dependent reverse-bias stress of normally-off GaN power FETs

Giuliani, F., Delmonte, N., Cova, P., Menozzi, R.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.75 MB

english, 2013

77

Avoiding misleading artefacts in metallurgical preparation of die attach solder joints in high power modules

Dugal, Franc, Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.69 MB

english, 2013

78

Field-effect control of breakdown paths in HfO2 based MIM structures

Saura, X., Lian, X., Jiménez, D., Miranda, E., Borrisé, X., Campabadal, F., Suñé, J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.31 MB

english, 2013

79

Failure analysis techniques for a 3D world

Henderson, Christopher L.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.18 MB

english, 2013

80

Variations in junction capacitance and doping activation associated with electrical stress of InGaN/GaN laser diodes

de Santi, C., Meneghini, M., Carraro, S., Vaccari, S., Trivellin, N., Marconi, S., Marioli, M., Meneghesso, G., Zanoni, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 809 KB

english, 2013

81

Unstructured tetrahedric meshes for the description of complex three-dimensional sample geometries in Monte Carlo simulation of scanning electron microscopy images for metrology applications

Ilgünsatiroglu, Emre, Illarionov, Alexey Yu., Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.12 MB

english, 2013

82

Frequency mapping in dynamic light emission with wavelet transform

Chef, S., Jacquir, S., Sanchez, K., Perdu, P., Binczak, S.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

83

Experimental investigation of Zener diode reliability under pulsed Electrical Overstress (EOS)

Zhu, F., Fouquet, F., Ravelo, B., Alaeddine, A., Kadi, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.02 MB

english, 2013

84

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Lau, F.L., I Made, Riko., Putra, W.N., Lim, J.Z., Nachiappan, V.C., Aw, J.L., Gan, C.L.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.29 MB

english, 2013

85

Reliability improvement of automotive electronics based on environmental stress screen methodology

Chan, S.I., Kang, J.H., Jang, J.S.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.25 MB

english, 2013

86

Solder joint reliability under realistic service conditions

Borgesen, P., Hamasha, S., Obaidat, M., Raghavan, V., Dai, X., Meilunas, M., Anselm, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 785 KB

english, 2013

87

Finite element modeling and characterization of lead-free solder joints fatigue life during power cycling of surface mounting power devices

Delmonte, N., Giuliani, F., Cova, P.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.96 MB

english, 2013

88

A novel test structure for OxRRAM process variability evaluation

Aziza, H., Bocquet, M., Portal, J.-M., Moreau, M., Muller, C.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.72 MB

english, 2013

89

Breakdown mechanisms in MgO based magnetic tunnel junctions and correlation with low frequency noise

Amara-Dababi, S., Sousa, R.C., Béa, H., Baraduc, C., Mackay, K., Dieny, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.10 MB

english, 2013

90

BTI, HCI and TDDB aging impact in flip–flops

Nunes, Cícero, Butzen, Paulo F., Reis, André I., Ribas, Renato P.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 679 KB

english, 2013

91

Effects of constant voltage stress on p- and n-type organic thin film transistors with poly(methyl methacrylate) gate dielectric

Wrachien, N., Cester, A., Bari, D., Capelli, R., D’Alpaos, R., Muccini, M., Stefani, A., Turatti, G., Meneghesso, G.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 641 KB

english, 2013

92

A new two-dimensional TCAD model for threshold instability in silicon carbide MOSFETs

Kikuchi, Takuo, Ciappa, Mauro

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.07 MB

english, 2013

93

Stress evolution in the metal layers of TSVs with Bosch scallops

Singulani, A.P., Ceric, H., Selberherr, S.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 766 KB

english, 2013

94

2MeV electron irradiation effects on the electrical characteristics of MOS capacitors with ALD Al2O3 dielectrics of different thickness

Rafí, J.M., González, M.B., Takakura, K., Tsunoda, I., Yoneoka, M., Beldarrain, O., Zabala, M., Campabadal, F.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.18 MB

english, 2013

95

Experimental analysis of electro-thermal instability in SiC Power MOSFETs

Riccio, M., Castellazzi, A., De Falco, G., Irace, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.14 MB

english, 2013

96

Resistive switching like-behavior in MOSFETs with ultra-thin HfSiON dielectric gate stack: pMOS and nMOS comparison and reliability implications

Crespo-Yepes, A., Martín-Martínez, J., Rodríguez, R., Nafría, M., Aymerich, X.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.26 MB

english, 2013

97

XEBIC at the Dual Beam

Vanzi, M., Podda, S., Musu, E., Cao, R.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 700 KB

english, 2013

98

ESD characterization of multi-chip RGB LEDs

Vaccari, S., Meneghini, M., Griffoni, A., Barbisan, D., Barbato, M., Carraro, S., La Grassa, M., Meneghesso, G., Zanoni, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1019 KB

english, 2013

99

IGBT chip current imaging system by scanning local magnetic field

Shiratsuchi, Hiroaki, Matsushita, Kohei, Omura, Ichiro

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.85 MB

english, 2013

100

Durability study of a fluorescent optical memory in glass studied by luminescence spectroscopy

Royon, A., Bourhis, K., Béchou, L., Cardinal, T., Canioni, L., Deshayes, Y.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.10 MB

english, 2013

101

Migration issues in sintered-silver die attaches operating at high temperature

Riva, R., Buttay, C., Allard, B., Bevilacqua, P.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.85 MB

english, 2013

102

Real time degradation monitoring system for high power IGBT module under power cycling test

Watanabe, Akihiko, Tsukuda, Masanori, Omura, Ichiro

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.06 MB

english, 2013

103

Analysis of ultracapacitors ageing in automotive application

Catelani, M., Ciani, L., Marracci, M., Tellini, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 836 KB

english, 2013

104

Detectability of automotive power MOSFET on-resistance failure at high current induced by Wafer Fab process excursion

Weber, Y., Goxe, J., Castignolles, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.51 MB

english, 2013

105

Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24V battery system applications

Rostaing, G., Berkani, M., Mechouche, D., Labrousse, D., Lefebvre, S., Khatir, Z., Dupuy, Ph.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.00 MB

english, 2013

106

Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects

Moujbani, Aymen, Kludt, Jörg, Weide-Zaage, Kirsten, Ackermann, Markus, Hein, Verena, Meinshausen, Lutz

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.29 MB

english, 2013

107

Sensitivity tuning of a bulk built-in current sensor for optimal transient-fault detection

Dutertre, J.M., Possamai Bastos, R., Potin, O., Flottes, M.L., Rouzeyre, B., Di Natale, G.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.38 MB

english, 2013

108

Improved bending fatigue life of single crystal silicon micro-beam by phosphorus doping

Tao, Jun-Yong, Wang, Xiao-Jing, Liu, Bin, Wang, Yan-Lei, Ren, Zhi-Qian, Chen, Xun

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

109

A comparative study on device degradation under a positive gate stress and hot carrier stress in InGaZnO thin film transistors

Jang, Hyun Jun, Lee, Seung Min, Yu, Chong Gun, Park, Jong Tae

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 987 KB

english, 2013

110

Dynamic simulation of octahedron slotted metal structures

Kludt, J., Weide-Zaage, K., Ackermann, M., Hein, V.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.59 MB

english, 2013

111

SNaP: A novel hybrid method for circuit reliability assessment under multiple faults

Pagliarini, S.N., Ben Dhia, A., Naviner, L.A. de B., Naviner, J.-F.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 603 KB

english, 2013

112

Thermal optimization of water heat sink for power converters with tight thermal constraints

Cova, P., Delmonte, N., Giuliani, F., Citterio, M., Latorre, S., Lazzaroni, M., Lanza, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.92 MB

english, 2013

113

Editorial

Labat, Nathalie, Marc, François

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 164 KB

english, 2013

114

Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques

Ben Naceur, W., Malbert, N., Labat, N., Frémont, H., Carisetti, D., Clément, J.-C., Muraro, J.-L., Bonnet, B.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.81 MB

english, 2013

115

Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules

Pedersen, Kristian Bonderup, Kristensen, Peter Kjær, Popok, Vladimir, Pedersen, Kjeld

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.80 MB

english, 2013

116

Overview of catastrophic failures of freewheeling diodes in power electronic circuits

Wu, R., Blaabjerg, F., Wang, H., Liserre, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 546 KB

english, 2013

117

Effective and reliable heat management for power devices exposed to cyclic short overload pulses

Nelhiebel, M., Illing, R., Detzel, Th., Wöhlert, S., Auer, B., Lanzerstorfer, S., Rogalli, M., Robl, W., Decker, S., Fugger, J., Ladurner, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.26 MB

english, 2013

118

Scattering parameter approach applied to the stability analysis of power IGBTs in short circuit

Abbate, C., Busatto, G., Iannuzzo, F., Ronsisvalle, C., Sanseverino, A., Velardi, F.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.81 MB

english, 2013

119

Qualification of 50V GaN on SiC technology for RF power amplifiers

Wel, P.J. van der, Roedle, T., Lambert, B., Blanck, H., Dammann, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 717 KB

english, 2013

120

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 37 KB

english, 2013

121

Impact of the forming conditions and electrode metals on read disturb in HfO2-based RRAM

Lorenzi, P., Rao, R., Prifti, T., Irrera, F.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.41 MB

english, 2013

122

A defect-tolerant area-efficient multiplexer for basic blocks in SRAM-based FPGAs

Ben Dhia, A., Pagliarini, S.N., de B. Naviner, L.A., Mehrez, H., Matherat, P.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 387 KB

english, 2013

123

Opens localization on silicon level in a Chip Scale Package using space domain reflectometry

Gaudestad, J., Talanov, V., Marchetti, M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.38 MB

english, 2013

124

On-chip circuit to monitor long-term NBTI and PBTI degradation

Jenkins, Keith A., Lu, Pong-Fei

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 792 KB

english, 2013

125

BTI and HCI first-order aging estimation for early use in standard cell technology mapping

Butzen, P.F., Dal Bem, V., Reis, A.I., Ribas, R.P.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 798 KB

english, 2013

126

Effect of negative bias temperature instability induced by a low stress voltage on nanoscale high-k/metal gate pMOSFETs

Lee, Seonhaeng, Kim, Cheolgyu, Kim, Hyeokjin, Kim, Gang-Jun, Seo, Ji-Hoon, Son, Donghee, Kang, Bongkoo

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 770 KB

english, 2013

127

Conductive adhesive joint for extreme temperature applications

Jullien, J.B., Frémont, H., Deletage, J.Y.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.30 MB

english, 2013

128

Comparison between positive and negative constant current stress on dye-sensitized solar cells

Bari, D., Wrachien, N., Tagliaferro, R., Brown, T.M., Reale, A., Di Carlo, A., Meneghesso, G., Cester, A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.49 MB

english, 2013

129

Impact of load pulse duration on power cycling lifetime of Al wire bonds

Scheuermann, U., Schmidt, R.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.13 MB

english, 2013

130

Influence of the interface trap location on the performance and variability of ultra-scaled MOSFETs

Velayudhan, V., Gamiz, F., Martin-Martinez, J., Rodriguez, R., Nafria, M., Aymerich, X.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.11 MB

english, 2013

131

Repairing bonding wire connections using a microsoldering unit inside an SEM

Rummel, Andreas, Schock, Klaus, Kemmler, Matthias, Smith, Andrew, Kleindiek, Stephan

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.73 MB

english, 2013

132

SEL-UP: A CAD tool for the sensitivity analysis of radiation-induced Single Event Latch-Up

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 850 KB

english, 2013

133

Impact of back gate biases on hot carrier effects in multiple gate junctionless transistors

Lee, Seung Min, Jang, Hyun Jun, Park, Jong Tae

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 987 KB

english, 2013

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