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Effects of copper and titanium addition to aluminum interconnects on electro- and stress-migration open circuit failures : T. Hosoda, H. Yagi and H. Tsuchikawa. 27th a. Proc. IEEE/IRPS Int. Reliab. Phys. Symp., 202 (1989)
Volume:
30
Year:
1990
Language:
english
DOI:
10.1016/0026-2714(90)90441-o
File:
PDF, 118 KB
english, 1990