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4965660 Integrated circuit package having heat sink bonded with resinous adhesive
Satoru Ogihara, Hironori Kodama, Nobuyuk Ushifusa, Kanji OtsukaVolume:
31
Year:
1991
Language:
english
DOI:
10.1016/0026-2714(91)90325-2
File:
PDF, 79 KB
english, 1991