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A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycles
J.H. Huang, Y.Y. Qian, Y.H. Jiang, Q.L. WangVolume:
33
Year:
1993
Language:
english
Pages:
8
DOI:
10.1016/0026-2714(93)90323-q
File:
PDF, 414 KB
english, 1993