A study on the forming simulation and formability of three dimensional bevel embossing of columnar array microstructures
Weng, Yung-JinVolume:
113
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.06.013
Date:
January, 2014
File:
PDF, 2.52 MB
english, 2014