Volume 113

Microelectronic Engineering

Volume 113

1

Effect of annealing temperature on resistance switching and dielectric characteristics of Bi4Ti3O12 thin films

Sun, Bing-Cheng, Wang, Hua, Xu, Ji-Wen, Yang, Ling, Zhou, Shang-Ju, Zhang, Yu-Pei, Li, Zhi-Da

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.15 MB

english, 2014

2

Influence of deposition time on the microstructure and dielectric properties of AlN/Si thin films for enhanced hydrogen sensing application

Vijayalakshmi, K., Pillay, V. Vasanthi

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.79 MB

english, 2014

3

Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

Parasuraman, Jayalakshmi, Summanwar, Anand, Marty, Frédéric, Basset, Philippe, Angelescu, Dan E., Bourouina, Tarik

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 957 KB

english, 2014

4

Atomic force microscope microcantilevers used as sensors for monitoring humidity

Steffens, C., Manzoli, A., Leite, F.L., Fatibello, O., Herrmann, P.S.P.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 770 KB

english, 2014

5

Effects of polydimethylsiloxane (PDMS) microchannels on surface acoustic wave-based microfluidic devices

Jo, Myeong Chan, Guldiken, Rasim

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.95 MB

english, 2014

6

High resolution nanotopography characterization at die scale of 28nm FDSOI CMOS front-end CMP processes

Dettoni, F., Rivoire, M., Gaillard, S., Hinsinger, O., Bertin, F., Beitia, C.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.40 MB

english, 2014

7

A high-efficiency multi-beam splitter for optical pickups using ultra-precision manufacturing

Hsu, Jo-Han, Lee, Chi-Hung, Chen, Rongshun

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 2.08 MB

english, 2014

8

An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip

Lee, Kuo-Yu, Huang, Jung-Tang, Chao, Pen-Shan, Lin, Jian-Ming, Hsu, Hou-Jun

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 2.57 MB

english, 2014

9

Fabrication and characterization of copper interconnects of line-width down to 100nm using a specially designed phase shift mask

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 2.30 MB

english, 2014

10

Effects of physico-chemical properties between poly(ethyleneimine) and silica abrasive on copper chemical mechanical planarization

Seo, Jihoon, Yoon, Kwang Seob, Moon, Jinok, Kim, Kijung, Sigmund, Wolfgang, Paik, Ungyu

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 935 KB

english, 2014

11

High power density AlGaAs/InGaAs/GaAs PHEMTs using an optimised manufacturing process for Ka-band applications

Cho, Sung-Jin, Wang, Cong, Kim, Nam-Young

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 3.52 MB

english, 2014

12

A large current scanning electron microscope with MEMS-based multi-beam optics

Ichimura, Takashi, Ren, Yan, Kruit, P.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.56 MB

english, 2014

13

A study on the forming simulation and formability of three dimensional bevel embossing of columnar array microstructures

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 2.52 MB

english, 2014

14

Inside Front Cover - Editorial Board

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 30 KB

english, 2014

15

Fabrication of well-controlled wavy metal interconnect structures on stress-free elastomeric substrates

Park, Chan Woo, Jung, Soon Won, Lim, Sang Chul, Oh, Ji-Young, Na, Bock Soon, Lee, Sang Seok, Chu, Hye Yong, Koo, Jae Bon

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.99 MB

english, 2014

16

Impact of Si cap, strain and temperature on the hole mobility of (s)Si/sSiGe/(s)SOI quantum-well p-MOSFETs

Yu, W., Zhang, B., Liu, C., Zhao, Y., Wu, W.R., Xue, Z.Y., Chen, M., Buca, D., Hartmann, J.-M., Wang, X., Zhao, Q.T., Mantl, S.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.48 MB

english, 2014

17

Recrystallization process controlled by staircase pulse in phase change memory

Yin, You, Kobayashi, Ryota, Hosaka, Sumio

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.39 MB

english, 2014

18

Deep single step vertical ICP–RIE etching of ion beam sputter deposited SiO2/Si multilayer stacks

Messow, Ferdinand, Welch, Colin, Eifert, Alexander, Ang, Wei Chung, Hoe, Nee Shiuan, Kusserow, Thomas, Hillmer, Hartmut

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 565 KB

english, 2014

19

Micro-fabrication of high-thickness spiral inductors for the remote powering of implantable biosensors

Olivo, Jacopo, Carrara, Sandro, De Micheli, Giovanni

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.18 MB

english, 2014

20

Fabrication of nano metallic holes for color filters based on a controllable self-assembly of polystyrene spheres

Li, Shuhong, Ren, Liangke, Yang, Zheng, Zhang, Zhiyou, Gao, Fuhua, Du, Jinglei, Zhang, Sijie

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.15 MB

english, 2014

21

Polycarbonate electron beam resist using solvent developer

Abbas, Arwa Saud, Yavuz, Mustafa, Cui, Bo

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 668 KB

english, 2014

22

Corrigendum to: “Duty ratio impact on SiN films deposited in SiH4-NH3 plasma at room temperature” [Microelectron. Eng. 89 (2011) 116–119]

Kim, Daehyun, Kim, Byungwhan, Yoon, Neung-Goo

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 174 KB

english, 2014

23

Reflow processes in micro-bumps studied by synchrotron X-ray projection nanotomography

Bertheau, J., Bleuet, P., Hodaj, F., Cloetens, P., Martin, N., Charbonnier, J., Hotellier, N.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 2.26 MB

english, 2014

24

Enhanced selectivity over a photoresist film and process optimization for reactive ion etching of NiCr

Gou, Jun, Wang, Jun, Tai, Huiling, Li, Weizhi, Gu, Deen, Jiang, Yadong

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.04 MB

english, 2014

25

Three-dimensional metallic microcomponents achieved in fused silica by a femtosecond-laser-based microsolidifying process

Liu, Keyin, Yang, Qing, Zhao, Yulong, Chen, Feng, Shan, Chao, He, Shengguan, Fan, Xiaole, li, Lei, Meng, Xiangwei, Du, Guangqing, Bian, Hao

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.28 MB

english, 2014

26

Recycling a slurry for reuse in chemical mechanical planarization of tungsten wafer: Effect of chemical adjustments and comparison between static and dynamic experiments

Testa, F., Coetsier, C., Carretier, E., Ennahali, M., Laborie, B., Moulin, P.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.69 MB

english, 2014

27

Single-electron injections in fringing-field-induced charge-trapping memories

Chiang, K.H., Chou, S.W., Hsu, H.C., Jeng, E.S.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.04 MB

english, 2014

28

The calculation of the reflection coefficients by analyzing resistivity data of the Ni–Si silicide films formed at 850°C by RTA

Utlu, G., Artunç, N.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 1.10 MB

english, 2014

29

Fluid–structure interaction analysis on the effect of chip stacking in a 3D integrated circuit package with through-silicon vias during plastic encapsulation

Ong, Ernest E.S., Abdullah, M.Z., Khor, C.Y., Loh, W.K., Ooi, C.K., Chan, R.

Journal:

Microelectronic Engineering

Year:

2014

Language:

english

File:

PDF, 3.22 MB

english, 2014

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