Influence of copper diffusion on the shape of whiskers...

Microelectronics Reliability 2013 / 7 Vol. 53; Iss. 7

Influence of copper diffusion on the shape of whiskers grown on bright tin layers

Horváth, Barbara
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.03.008
Date:
July, 2013
File:
PDF, 5.60 MB
english, 2013
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