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Volume 53; Issue 7
Main
Microelectronics Reliability
Volume 53; Issue 7
Microelectronics Reliability
Volume 53; Issue 7
1
Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model
Ren, Huai-Hui
,
Wang, Xi-Shu
,
Jia, Su
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.49 MB
Your tags:
english, 2013
2
Could electronics reliability be predicted, quantified and assured?
Suhir, Ephraim
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 283 KB
Your tags:
english, 2013
3
Compliance analysis of multi-path fan-shaped interconnects
Chen, Wei
,
Okereke, Raphael
,
Sitaraman, Suresh K.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.48 MB
Your tags:
english, 2013
4
Influence of copper diffusion on the shape of whiskers grown on bright tin layers
Horváth, Barbara
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 5.60 MB
Your tags:
english, 2013
5
Inside front cover - Editorial board
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 37 KB
Your tags:
english, 2013
6
Hot hole-induced device degradation by drain junction reverse current
Kim, K.S.
,
Kim, H.J.
,
Choi, P.H.
,
Park, H.S.
,
Joo, I.H.
,
Song, J.E.
,
Song, D.H.
,
Choi, B.D.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 849 KB
Your tags:
english, 2013
7
DSP based fuzzy and conventional overcurrent relay controller comparisons
Goh, Yin Lee
,
Ramasamy, Agileswari K.
,
Nagi, Farrukh Hafiz
,
Zainul Abidin, Aidil Azwin
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 520 KB
Your tags:
english, 2013
8
Dynamic voltage and frequency scaling algorithm for fault-tolerant real-time systems
Djosic, Sandra
,
Jevtic, Milun
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 610 KB
Your tags:
english, 2013
9
Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor
Jablonski, M.
,
Bossuyt, F.
,
Vanfleteren, J.
,
Vervust, T.
,
de Vries, H.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.12 MB
Your tags:
english, 2013
10
Thermodynamic study on the corrosion mechanism of copper wire bonding
Zeng, Yingzhi
,
Bai, Kewu
,
Jin, Hongmei
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 4.00 MB
Your tags:
english, 2013
11
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding
Rezvani, A.
,
Shah, A.
,
Mayer, M.
,
Zhou, Y.
,
Moon, J.T.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.97 MB
Your tags:
english, 2013
12
Refined NBTI characterization of arbitrarily stressed PMOS devices at ultra-low and unique temperatures
Aichinger, Thomas
,
Nelhiebel, Michael
,
Grasser, Tibor
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 679 KB
Your tags:
english, 2013
13
Novel ESD protection solution for single-ended mixer in GaAs pHEMT technology
Cui, Qiang
,
Zhang, Shuyun
,
Liou, Juin J.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 929 KB
Your tags:
english, 2013
14
Efficient multi-level modeling technique for determining effective board drop reliability of PCB assembly
Yang, Fan
,
Meguid, Shaker A.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.27 MB
Your tags:
english, 2013
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