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Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards
Long, Xing-Ming, Liao, Rui-Jin, Zhou, Jing, Zeng, ZhiVolume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.11.008
Date:
April, 2013
File:
PDF, 2.99 MB
english, 2013