Contoured device sample preparation technique for ±5μm...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Contoured device sample preparation technique for ±5μm remaining silicon thicknesses that meets solid immersion lens requirements

Richardson, Chris, Liechty, Gary, Smith, Clay, Karow, Michael
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.073
Date:
September, 2013
File:
PDF, 1.83 MB
english, 2013
Conversion to is in progress
Conversion to is failed