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A novel soldering method to evaluate PCB pad cratering for pin-pull testing
Cai, M., Xie, D.J., Chen, W.B., Wu, B.Y., Yang, D.G., Zhang, G.Q.Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.025
Date:
September, 2013
File:
PDF, 1.92 MB
english, 2013