Electro- and thermomigration-induced IMC formation in...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads

Meinshausen, L., Frémont, H., Weide-Zaage, K., Plano, B.
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.038
Date:
September, 2013
File:
PDF, 1.62 MB
english, 2013
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