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Influence of the clamping pressure on the electrical, thermal and mechanical behaviour of press-pack IGBTs
Poller, T., D’Arco, S., Hernes, M., Rygg Ardal, A., Lutz, J.Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.130
Date:
September, 2013
File:
PDF, 2.01 MB
english, 2013