Thermal characterizations of Cu nanoparticle joints for...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Thermal characterizations of Cu nanoparticle joints for power semiconductor devices

Ishizaki, T., Satoh, T., Kuno, A., Tane, A., Yanase, M., Osawa, F., Yamada, Y.
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.042
Date:
September, 2013
File:
PDF, 1.24 MB
english, 2013
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