Avoiding misleading artefacts in metallurgical preparation...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Avoiding misleading artefacts in metallurgical preparation of die attach solder joints in high power modules

Dugal, Franc, Ciappa, Mauro
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.064
Date:
September, 2013
File:
PDF, 1.69 MB
english, 2013
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