Electrical behavior of Au–Ge eutectic solder under aging...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Lau, F.L., I Made, Riko., Putra, W.N., Lim, J.Z., Nachiappan, V.C., Aw, J.L., Gan, C.L.
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.081
Date:
September, 2013
File:
PDF, 2.29 MB
english, 2013
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