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Finite element modeling and characterization of lead-free solder joints fatigue life during power cycling of surface mounting power devices
Delmonte, N., Giuliani, F., Cova, P.Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.06.021
Date:
September, 2013
File:
PDF, 1.96 MB
english, 2013