Growth mechanism of intermetallic compounds and damping...

Microelectronics Reliability 2014 / 05 Vol. 54; Iss. 5

Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1wt% nano-ZrO2 composite solders

Gain, Asit Kumar, Chan, Y.C.
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.01.026
Date:
May, 2014
File:
PDF, 2.53 MB
english, 2014
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