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Volume 54; Issue 5
Main
Microelectronics Reliability
Volume 54; Issue 5
Microelectronics Reliability
Volume 54; Issue 5
1
Experimental and numerical approach on junction temperature of high-power LED
Liu, Dongjing
,
Yang, Haiying
,
Yang, Ping
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.27 MB
Your tags:
english, 2014
2
Effect of temperature on the electrophysical properties of Si–polymer composite varistors
Ghafouri, M.
,
Parhizkar, M.
,
Mohammadi Aref, S.
,
Olad, A.
,
Bidadi, H.
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.87 MB
Your tags:
english, 2014
3
Tunnel FET technology: A reliability perspective
Datta, Suman
,
Liu, Huichu
,
Narayanan, Vijaykrishnan
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 6.05 MB
Your tags:
english, 2014
4
Liquid crystal electrography: Electric field mapping and detection of peak electric field strength in AlGaN/GaN high electron mobility transistors
Möreke, Janina
,
Hodges, Chris
,
Mears, Laura L.E.
,
Uren, Michael J.
,
Richardson, Robert M.
,
Kuball, Martin
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.13 MB
Your tags:
english, 2014
5
High-κ dielectric breakdown in nanoscale logic devices – Scientific insight and technology impact
Raghavan, Nagarajan
,
Pey, Kin Leong
,
Shubhakar, Kalya
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 5.27 MB
Your tags:
english, 2014
6
A study of ageing effect at elevated temperature of flexible silicon diodes integrated using conductive adhesives
Heath, Cory D.
,
Dinh, Chau
,
Doran, C.
,
Lau, S.S.
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 881 KB
Your tags:
english, 2014
7
A fast, flexible, and easy-to-develop FPGA-based fault injection technique
Ebrahimi, Mojtaba
,
Mohammadi, Abbas
,
Ejlali, Alireza
,
Miremadi, Seyed Ghassem
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 713 KB
Your tags:
english, 2014
8
Recovery and universality in NBTI
Yonamoto, Yoshiki
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 545 KB
Your tags:
english, 2014
9
Facile chemical method of etching polyimide films for failure analysis (FA) applications and its etching mechanism studies
Liu, Chien-Pan
,
Lin, Jeng-Yu
,
Liu, Yen-Fu
,
Chang, Shoou-Jinn
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 2.15 MB
Your tags:
english, 2014
10
Evaluation of Level of Confidence and Optimization of Roll-back Recovery with Checkpointing for Real-Time Systems
Nikolov, Dimitar
,
Ingelsson, Urban
,
Singh, Virendra
,
Larsson, Erik
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.23 MB
Your tags:
english, 2014
11
A novel hetero-junction Tunnel-FET using Semiconducting silicide–Silicon contact and its scalability
Wu, Yan
,
Hasegawa, Hiroyuki
,
Kakushima, Kuniyuki
,
Ohmori, Kenji
,
Watanabe, Takanobu
,
Nishiyama, Akira
,
Sugii, Nobuyuki
,
Wakabayashi, Hitoshi
,
Tsutsui, Kazuo
,
Kataoka, Yoshinori
,
Natori, Kenji
,
Yamada,
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.86 MB
Your tags:
english, 2014
12
BIST architecture for oscillation test of analog ICs and investigation of test hardware influence
Arbet, D.
,
Stopjaková, V.
,
Brenkuš, J.
,
Gyepes, G.
,
Kováč, M.
,
Majer, L.
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.11 MB
Your tags:
english, 2014
13
Investigation of interface, shallow and deep oxide traps under NBTI stress using charge pumping technique
Tahi, Hakim
,
Djezzar, Boualem
,
Benabdelmoumene, Abdelmadjid
,
Chenouf, Amel
,
Goudjil, Mohamed
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.47 MB
Your tags:
english, 2014
14
Algorithm transformation methods to reduce the overhead of software-based fault tolerance techniques
Azambuja, José Rodrigo
,
Brown, Gustavo
,
Kastensmidt, Fernanda Lima
,
Carro, Luigi
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 460 KB
Your tags:
english, 2014
15
CEDAR: Modeling impact of component error derating and read frequency on system-level vulnerability in high-performance processors
Asadi, Hossein
,
Haghdoost, Alireza
,
Ramezani, Morteza
,
Elyasi, Nima
,
Baniasadi, Amirali
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 2.03 MB
Your tags:
english, 2014
16
A dynamic synchronization method to realize soft defect localization applied on digital and mixed-mode analog ICs in failure analysis
Wu, Chunlei
,
Yao, Suying
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 3.02 MB
Your tags:
english, 2014
17
Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1wt% nano-ZrO2 composite solders
Gain, Asit Kumar
,
Chan, Y.C.
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 2.53 MB
Your tags:
english, 2014
18
Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies
Tian, Ye
,
Liu, Xi
,
Chow, Justin
,
Wu, Yi Ping
,
Sitaraman, Suresh K.
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.17 MB
Your tags:
english, 2014
19
Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues
Tanaka, Shuji
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 1.57 MB
Your tags:
english, 2014
20
Parameter estimation of the electrothermal model of the ferromagnetic core
Górecki, Krzysztof
,
Rogalska, Małgorzata
,
Zarębski, Janusz
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 614 KB
Your tags:
english, 2014
21
Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter
Tan, Cher Ming
,
Yu, Wen Zhi
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 2.61 MB
Your tags:
english, 2014
22
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates
An, Tong
,
Qin, Fei
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 2.35 MB
Your tags:
english, 2014
23
Characterization of MIS structures and PTFTs using TiOx deposited by spin-coating
Meneses, C.
,
Sanchez, J.G.
,
Estrada, M.
,
Cerdeira, A.
,
Pallarés, J.
,
Iñiguez, B.
,
Marsal, L.F.
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 692 KB
Your tags:
english, 2014
24
Thermal stress in through-silicon-vias: Theory-of-elasticity approach
Suhir, E.
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 875 KB
Your tags:
english, 2014
25
Effect of gate barrier and channel buffer layer on electric properties and transparence of the a-IGZO thin film transistor
Lin, Cheng-I
,
Fang, Yean-Kuen
,
Chang, Wei-Chao
,
Chiou, Mao-Wei
,
Chen, Chih-Wei
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 2.26 MB
Your tags:
english, 2014
26
Inside front cover - Editorial board
Journal:
Microelectronics Reliability
Year:
2014
Language:
english
File:
PDF, 38 KB
Your tags:
english, 2014
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