Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies
Tian, Ye, Liu, Xi, Chow, Justin, Wu, Yi Ping, Sitaraman, Suresh K.Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.01.011
Date:
May, 2014
File:
PDF, 1.17 MB
english, 2014