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Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues
Tanaka, ShujiVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.02.001
Date:
May, 2014
File:
PDF, 1.57 MB
english, 2014