Migration issues in sintered-silver die attaches operating...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Migration issues in sintered-silver die attaches operating at high temperature

Riva, R., Buttay, C., Allard, B., Bevilacqua, P.
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.103
Date:
September, 2013
File:
PDF, 1.85 MB
english, 2013
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