Failure analysis of through-silicon vias in free-standing...

Microelectronics Reliability 2013 / 1 Vol. 53; Iss. 1

Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test

Liu, Xi, Chen, Qiao, Sundaram, Venkatesh, Tummala, Rao R., Sitaraman, Suresh K.
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.06.140
Date:
January, 2013
File:
PDF, 1.67 MB
english, 2013
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