Study on the shear strength degradation of ACA joints...

Microelectronics Reliability 2013 / 12 Vol. 53; Iss. 12

Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions

Wu, Guanghua, Tao, Bo, Yin, Zhouping
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.06.011
Date:
December, 2013
File:
PDF, 2.46 MB
english, 2013
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