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Volume 53; Issue 12
Main
Microelectronics Reliability
Volume 53; Issue 12
Microelectronics Reliability
Volume 53; Issue 12
1
High temperature physical modeling and verification of a novel 4H-SiC lateral JFET structure
Zhong, Xueqian
,
Zhang, Li
,
Xie, Gang
,
Guo, Qing
,
Wang, Tao
,
Sheng, Kuang
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.51 MB
Your tags:
english, 2013
2
A new statistical methodology predicting chip failure probability considering electromigration
Sun, Ted
,
Mutlu, Ayhan
,
Rahman, Mahmudur
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.76 MB
Your tags:
english, 2013
3
Conduction mechanisms in thermal nitride and dry gate oxides grown on 4H-SiC
Ouennoughi, Z.
,
Strenger, C.
,
Bourouba, F.
,
Haeublein, V.
,
Ryssel, H.
,
Frey, L.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 982 KB
Your tags:
english, 2013
4
Time-dependent dielectric breakdown (TDDB) distribution in n-MOSFET with HfSiON gate dielectrics under DC and AC stressing
Hirano, Izumi
,
Nakasaki, Yasushi
,
Fukatsu, Shigeto
,
Goto, Masakazu
,
Nagatomo, Koji
,
Inumiya, Seiji
,
Sekine, Katsuyuki
,
Mitani, Yuichiro
,
Yamabe, Kikuo
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.08 MB
Your tags:
english, 2013
5
Experimental investigation on the performance of CPU coolers: Effect of heat pipe inclination angle and the use of nanofluids
Yousefi, T.
,
Mousavi, S.A.
,
Farahbakhsh, B.
,
Saghir, M.Z.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.80 MB
Your tags:
english, 2013
6
Effects of zirconium doping on the characteristics of tin oxide thin film transistors
Han, Dong-Suk
,
Park, Jae-Hyung
,
Kang, Yu-Jin
,
Park, Jong-Wan
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.11 MB
Your tags:
english, 2013
7
Sidewall defects of AlGaN/GaN HEMTs evaluated by low frequency noise analysis
Chiu, Hsien-Chin
,
Chen, Chao-Hung
,
Kao, Hsuan-Ling
,
Chien, Feng-Tso
,
Weng, Ping-Kuo
,
Gau, Yan-Tang
,
Chuang, Hao-Wei
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 597 KB
Your tags:
english, 2013
8
The evaluation for the chromatic characteristics of LED module under electrical and thermal coupling analysis
Fu, Han Kuei
,
Peng, Yi Ping
,
Ying, Shang Pin
,
Chen, Tzung Te
,
Wang, Chien Ping
,
Chen, Chiu Ling
,
Chou, Pei Ting
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 948 KB
Your tags:
english, 2013
9
Book Review
Naikan, Vallayil N.A.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 147 KB
Your tags:
english, 2013
10
Book review
Davidović, Vojkan
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 149 KB
Your tags:
english, 2013
11
Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions
Wu, Guanghua
,
Tao, Bo
,
Yin, Zhouping
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.46 MB
Your tags:
english, 2013
12
Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test
Yoon, Jeong-Won
,
Ko, Min-Kwan
,
Noh, Bo-In
,
Jung, Seung-Boo
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 3.11 MB
Your tags:
english, 2013
13
Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation
Lin, Nay
,
Miao, Jianmin
,
Dixit, Pradeep
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 4.86 MB
Your tags:
english, 2013
14
Study on low-Ag content Sn–Ag–Zn/Cu solder joints
Luo, Tingbi
,
Chen, Zhuo
,
Hu, Anmin
,
Li, Ming
,
Li, Peng
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 6.62 MB
Your tags:
english, 2013
15
Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations
Kuo, Chin-Hung
,
Hua, Hsin-Hui
,
Chan, Ho-Yang
,
Yang, Tsung-Hsun
,
Lin, Kuen-Song
,
Ho, Cheng-En
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.66 MB
Your tags:
english, 2013
16
Recent advances of nanolead-free solder material for low processing temperature interconnect applications
Jiang, Hongjin
,
Moon, Kyoung-sik
,
Wong, C.P.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 3.12 MB
Your tags:
english, 2013
17
Degradation of thermal interface materials for high-temperature power electronics applications
Skuriat, R.
,
Li, J.F.
,
Agyakwa, P.A.
,
Mattey, N.
,
Evans, P.
,
Johnson, C.M.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 3.03 MB
Your tags:
english, 2013
18
Delay fault testing using partial multiple scan chains
Bareisa, Eduardas
,
Jusas, Vacius
,
Motiejunas, Kestutis
,
Seinauskas, Rimantas
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 555 KB
Your tags:
english, 2013
19
On the assessment of voids in the thermal interface material on the thermal performance of a silicon chip package
Ramos-Alvarado, Bladimir
,
Brown, David
,
Chen, Xiuping
,
Feng, Bo
,
Peterson, G.P.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.72 MB
Your tags:
english, 2013
20
Quantum size impacts on the threshold voltage in nanocrystalline silicon thin film transistors
Mao, Ling-Feng
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 518 KB
Your tags:
english, 2013
21
Controlling of conduction mechanism and electronic parameters of silicon–metal junction by mixed Methylene Blue/2′-7′-dichlorofluorescein
Soylu, M.
,
Al-Hartomy, Omar A.
,
Farha Al Said, Said A
,
Al-Ghamdi, Ahmed A.
,
Yahia, I.S.
,
Yakuphanoglu, Fahrettin
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 856 KB
Your tags:
english, 2013
22
Long term storage reliability of antifuse field programmable gate arrays
Patil, Nishad
,
Das, Diganta
,
Scanff, Estelle
,
Pecht, Michael
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 947 KB
Your tags:
english, 2013
23
Explanation of impact load curve in ball impact test in relation to thermal aging
Daito, Tomoya
,
Nishikawa, Hiroshi
,
Takemoto, Tadashi
,
Matsunami, Takashi
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.05 MB
Your tags:
english, 2013
24
Influence of channel layer and passivation layer on the stability of amorphous InGaZnO thin film transistors
Zhan, Runze
,
Dong, Chengyuan
,
Liu, Po-Tsun
,
Shieh, Han-Ping D.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.24 MB
Your tags:
english, 2013
25
Large area flexible lighting foils using distributed bare LED dies on polyester substrates
van den Ende, D.A.
,
Kusters, R.H.L.
,
Cauwe, M.
,
van der Waal, A.
,
van den Brand, J.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.20 MB
Your tags:
english, 2013
26
Thermal and voltage instabilities of hafnium oxide films prepared by sputtering technique
Wong, Hei
,
Yang, B.L.
,
Dong, Shurong
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.40 MB
Your tags:
english, 2013
27
Inside front cover - Editorial board
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 37 KB
Your tags:
english, 2013
28
Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global–local modeling technique
Cinar, Yusuf
,
Jang, Jinwoo
,
Jang, Gunhee
,
Kim, Seonsik
,
Jang, Jaeseok
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 3.27 MB
Your tags:
english, 2013
29
Lifetime investigation and prediction of metallized polypropylene film capacitors
Li, Zhiwei
,
Li, Hua
,
Lin, Fuchang
,
Chen, Yaohong
,
Liu, De
,
Wang, Bowen
,
Li, Haoyuan
,
Zhang, Qin
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 832 KB
Your tags:
english, 2013
30
Effect of moisture condensation on long-term reliability of crystalline silicon photovoltaic modules
Park, Nochang
,
Han, Changwoon
,
Kim, Donghwan
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.45 MB
Your tags:
english, 2013
31
Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology
Leong, W.C.
,
Abdullah, M.Z.
,
Khor, C.Y.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.99 MB
Your tags:
english, 2013
32
Reliable ultra-low-voltage low-power probabilistic-based noise-tolerant latch design
Wey, I-Chyn
,
Lan, Yi-Jung
,
Peng, Chien-Chang
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 2.19 MB
Your tags:
english, 2013
33
Understanding and modeling of internal transient latch-up susceptibility in CMOS inverters due to microwave pulses
Chen, Jie
,
Du, Zhengwei
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 958 KB
Your tags:
english, 2013
34
Impact of bilayer character on High K gate stack dielectrics breakdown obtained by conductive atomic force microscopy
Foissac, R.
,
Blonkowski, S.
,
Kogelschatz, M.
,
Delcroix, P.
,
Gros-Jean, M.
,
Bassani, F.
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 869 KB
Your tags:
english, 2013
35
Degradation mechanism of concentrator solar receivers without protection layer
Hong, Hwen-Fen
,
Huang, Tsung-Shiew
,
Chiang, Mei-Hui
,
Shih, Zun-Hao
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 1.82 MB
Your tags:
english, 2013
36
Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection
Noae, Takuya
,
Ikeuchi, Tamao
,
Moritni, Chie
,
Endoh, Hirohiko
,
Yokoyama, Kohichi
Journal:
Microelectronics Reliability
Year:
2013
Language:
english
File:
PDF, 3.13 MB
Your tags:
english, 2013
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