Volume 53; Issue 12

Microelectronics Reliability

Volume 53; Issue 12

1

High temperature physical modeling and verification of a novel 4H-SiC lateral JFET structure

Zhong, Xueqian, Zhang, Li, Xie, Gang, Guo, Qing, Wang, Tao, Sheng, Kuang

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.51 MB

english, 2013

2

A new statistical methodology predicting chip failure probability considering electromigration

Sun, Ted, Mutlu, Ayhan, Rahman, Mahmudur

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.76 MB

english, 2013

3

Conduction mechanisms in thermal nitride and dry gate oxides grown on 4H-SiC

Ouennoughi, Z., Strenger, C., Bourouba, F., Haeublein, V., Ryssel, H., Frey, L.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 982 KB

english, 2013

4

Time-dependent dielectric breakdown (TDDB) distribution in n-MOSFET with HfSiON gate dielectrics under DC and AC stressing

Hirano, Izumi, Nakasaki, Yasushi, Fukatsu, Shigeto, Goto, Masakazu, Nagatomo, Koji, Inumiya, Seiji, Sekine, Katsuyuki, Mitani, Yuichiro, Yamabe, Kikuo

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.08 MB

english, 2013

5

Experimental investigation on the performance of CPU coolers: Effect of heat pipe inclination angle and the use of nanofluids

Yousefi, T., Mousavi, S.A., Farahbakhsh, B., Saghir, M.Z.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.80 MB

english, 2013

6

Effects of zirconium doping on the characteristics of tin oxide thin film transistors

Han, Dong-Suk, Park, Jae-Hyung, Kang, Yu-Jin, Park, Jong-Wan

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.11 MB

english, 2013

7

Sidewall defects of AlGaN/GaN HEMTs evaluated by low frequency noise analysis

Chiu, Hsien-Chin, Chen, Chao-Hung, Kao, Hsuan-Ling, Chien, Feng-Tso, Weng, Ping-Kuo, Gau, Yan-Tang, Chuang, Hao-Wei

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 597 KB

english, 2013

8

The evaluation for the chromatic characteristics of LED module under electrical and thermal coupling analysis

Fu, Han Kuei, Peng, Yi Ping, Ying, Shang Pin, Chen, Tzung Te, Wang, Chien Ping, Chen, Chiu Ling, Chou, Pei Ting

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 948 KB

english, 2013

9

Book Review

Naikan, Vallayil N.A.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 147 KB

english, 2013

10

Book review

Davidović, Vojkan

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 149 KB

english, 2013

11

Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions

Wu, Guanghua, Tao, Bo, Yin, Zhouping

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.46 MB

english, 2013

12

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test

Yoon, Jeong-Won, Ko, Min-Kwan, Noh, Bo-In, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.11 MB

english, 2013

13

Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation

Lin, Nay, Miao, Jianmin, Dixit, Pradeep

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 4.86 MB

english, 2013

14

Study on low-Ag content Sn–Ag–Zn/Cu solder joints

Luo, Tingbi, Chen, Zhuo, Hu, Anmin, Li, Ming, Li, Peng

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 6.62 MB

english, 2013

15

Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations

Kuo, Chin-Hung, Hua, Hsin-Hui, Chan, Ho-Yang, Yang, Tsung-Hsun, Lin, Kuen-Song, Ho, Cheng-En

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.66 MB

english, 2013

16

Recent advances of nanolead-free solder material for low processing temperature interconnect applications

Jiang, Hongjin, Moon, Kyoung-sik, Wong, C.P.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.12 MB

english, 2013

17

Degradation of thermal interface materials for high-temperature power electronics applications

Skuriat, R., Li, J.F., Agyakwa, P.A., Mattey, N., Evans, P., Johnson, C.M.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.03 MB

english, 2013

18

Delay fault testing using partial multiple scan chains

Bareisa, Eduardas, Jusas, Vacius, Motiejunas, Kestutis, Seinauskas, Rimantas

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 555 KB

english, 2013

19

On the assessment of voids in the thermal interface material on the thermal performance of a silicon chip package

Ramos-Alvarado, Bladimir, Brown, David, Chen, Xiuping, Feng, Bo, Peterson, G.P.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.72 MB

english, 2013

20

Quantum size impacts on the threshold voltage in nanocrystalline silicon thin film transistors

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 518 KB

english, 2013

21

Controlling of conduction mechanism and electronic parameters of silicon–metal junction by mixed Methylene Blue/2′-7′-dichlorofluorescein

Soylu, M., Al-Hartomy, Omar A., Farha Al Said, Said A, Al-Ghamdi, Ahmed A., Yahia, I.S., Yakuphanoglu, Fahrettin

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 856 KB

english, 2013

22

Long term storage reliability of antifuse field programmable gate arrays

Patil, Nishad, Das, Diganta, Scanff, Estelle, Pecht, Michael

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 947 KB

english, 2013

23

Explanation of impact load curve in ball impact test in relation to thermal aging

Daito, Tomoya, Nishikawa, Hiroshi, Takemoto, Tadashi, Matsunami, Takashi

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.05 MB

english, 2013

24

Influence of channel layer and passivation layer on the stability of amorphous InGaZnO thin film transistors

Zhan, Runze, Dong, Chengyuan, Liu, Po-Tsun, Shieh, Han-Ping D.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.24 MB

english, 2013

25

Large area flexible lighting foils using distributed bare LED dies on polyester substrates

van den Ende, D.A., Kusters, R.H.L., Cauwe, M., van der Waal, A., van den Brand, J.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.20 MB

english, 2013

26

Thermal and voltage instabilities of hafnium oxide films prepared by sputtering technique

Wong, Hei, Yang, B.L., Dong, Shurong

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.40 MB

english, 2013

27

Inside front cover - Editorial board

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 37 KB

english, 2013

28

Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global–local modeling technique

Cinar, Yusuf, Jang, Jinwoo, Jang, Gunhee, Kim, Seonsik, Jang, Jaeseok

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.27 MB

english, 2013

29

Lifetime investigation and prediction of metallized polypropylene film capacitors

Li, Zhiwei, Li, Hua, Lin, Fuchang, Chen, Yaohong, Liu, De, Wang, Bowen, Li, Haoyuan, Zhang, Qin

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 832 KB

english, 2013

30

Effect of moisture condensation on long-term reliability of crystalline silicon photovoltaic modules

Park, Nochang, Han, Changwoon, Kim, Donghwan

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.45 MB

english, 2013

31

Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology

Leong, W.C., Abdullah, M.Z., Khor, C.Y.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.99 MB

english, 2013

32

Reliable ultra-low-voltage low-power probabilistic-based noise-tolerant latch design

Wey, I-Chyn, Lan, Yi-Jung, Peng, Chien-Chang

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 2.19 MB

english, 2013

33

Understanding and modeling of internal transient latch-up susceptibility in CMOS inverters due to microwave pulses

Chen, Jie, Du, Zhengwei

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 958 KB

english, 2013

34

Impact of bilayer character on High K gate stack dielectrics breakdown obtained by conductive atomic force microscopy

Foissac, R., Blonkowski, S., Kogelschatz, M., Delcroix, P., Gros-Jean, M., Bassani, F.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 869 KB

english, 2013

35

Degradation mechanism of concentrator solar receivers without protection layer

Hong, Hwen-Fen, Huang, Tsung-Shiew, Chiang, Mei-Hui, Shih, Zun-Hao

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.82 MB

english, 2013

36

Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection

Noae, Takuya, Ikeuchi, Tamao, Moritni, Chie, Endoh, Hirohiko, Yokoyama, Kohichi

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 3.13 MB

english, 2013