Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates
An, Tong, Qin, FeiVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.01.008
Date:
May, 2014
File:
PDF, 2.35 MB
english, 2014