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Effect of thermal treatment on the mechanical properties of Cu specimen fabricated using electrodeposition bath for through-silicon-via filling
Wang, Huiying, Cheng, Ping, Wang, Su, Wang, Hong, Gu, Ting, Li, Junyi, Gu, Xiao, Ding, GuifuVolume:
114
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.09.007
Date:
February, 2014
File:
PDF, 1.63 MB
english, 2014