On the assessment of voids in the thermal interface...

Microelectronics Reliability 2013 / 12 Vol. 53; Iss. 12

On the assessment of voids in the thermal interface material on the thermal performance of a silicon chip package

Ramos-Alvarado, Bladimir, Brown, David, Chen, Xiuping, Feng, Bo, Peterson, G.P.
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.05.006
Date:
December, 2013
File:
PDF, 1.72 MB
english, 2013
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