Failure analysis of GaAs microwave devices with plastic...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques

Ben Naceur, W., Malbert, N., Labat, N., Frémont, H., Carisetti, D., Clément, J.-C., Muraro, J.-L., Bonnet, B.
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.105
Date:
September, 2013
File:
PDF, 1.81 MB
english, 2013
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