Micro-sectioning approach for quality and reliability...

Microelectronics Reliability 2013 / 9 Vol. 53; Iss. 9-11

Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules

Pedersen, Kristian Bonderup, Kristensen, Peter Kjær, Popok, Vladimir, Pedersen, Kjeld
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.010
Date:
September, 2013
File:
PDF, 1.80 MB
english, 2013
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