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Focused electron and ion beam repair strategies for wafer-scale interconnections in thin film packaging
H.T. Lin, J.F. McDonald, J.C. Corelli, S. Balakrishnan, N. KingVolume:
166
Year:
1988
Language:
english
Pages:
10
DOI:
10.1016/0040-6090(88)90372-0
File:
PDF, 1.00 MB
english, 1988