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Selective electroless copper plating on silicon seeded by copper ion implantation
S. Bhansali, D.K. Sood, R.B. ZmoodVolume:
253
Year:
1994
Language:
english
Pages:
4
DOI:
10.1016/0040-6090(94)90354-9
File:
PDF, 495 KB
english, 1994